WTO LF4000-GS/305-4A Lead-Free Solder Paste
Key Features and Technologies
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Excellent continuous printing performance, especially suitable for fine-pitch printing, with good off-grid performance and strong adhesion.
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Wide reflow profile window, ensuring high-quality solderability across a broad temperature range.
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Outstanding solderability and tin-penetration performance, producing full and bright solder joints.
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Minimal residue and reliable electrical properties.
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Meets the printing requirements of 0.25 mm ultra-fine-pitch components and 01005 pad layouts.
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Suitable for welding processes even in non-nitrogen protective atmospheres.
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Excellent ICT test performance.
Product overview WTO LF4000-GS/305-4A Lead-Free Solder Paste
WTO-LF4000-GS/305-4A is a lead-free，no-clean solder paste , especially designed for lead-free solder powder (Sn/Ag/Cu system) according to the flux system,including of flux with good wetting, excellent weldability, high reliability, completely halogen-free and lead-free alloy powder with high degree of sphericity and low oxygen content.It can reduce effectively free energy between lead-free solder molecular and surface tension, and increase flowability and solderability of lead-free
Technical specifications
| Test Items | Specifications | Test Methods |
| Alloy Component | Sn96.5Ag3.0Cu0.5 | / |
| Powder Size | Type 4 (20–38 µm) | / |
| Viscosity (Pa·s @25±0.2°C, 10 rpm/min) | 190 ± 30 | Malcom PCU 205 |
| Metal Content (%) | 88.20 ± 0.50 | IPC-TM-650 2.2.20 |
| Flux Content (%) | 11.80 ± 0.50 | IPC-TM-650 2.2.20 |
| Solder Ball Test | Pass | IPC-TM-650 2.4.43 |
| Wetting Test | Pass | IPC-TM-650 2.4.45 |
| Slump Test | Pass | IPC-TM-650 2.4.35 |
| Halide Content (%) | HF | EN 14582:2016 |
| Electrochemical Migration (ECM) | Pass | IPC-TM-650 2.6.14.1 |
| Copper Mirror Test | Pass | IPC-TM-650 2.3.32 |
| SIR (168 h @85°C, 85%RH) | ≥ 1 × 10 | IPC-TM-650 2.6.3.3 |
| RoHS | Pass | RoHS |
Applications
Provides excellent soldering performance on PCB boards with bare copper, immersion gold, immersion tin, OSP surface treatments, and other lead-free solder alloy components. It is widely used in computer motherboards, communication devices, audio equipment, refrigeration devices, automotive electronics, instrumentation, medical equipment, and other electronic devices that require high reliability and high quality.
