Low-Solid No-Clean Lead-Free Soldering Flux WTO-518E

Description

WTO-518E is a low-solid, no-clean, lead-free soldering flux formulated with enhanced rosin and resin systems, organic activating agents, and carefully selected additives and solvents. It delivers excellent solderability with strong wettability, smooth solder flow, and reliable tin penetration, resulting in bright and well-formed solder joints. The low solid content minimizes post-soldering residues while maintaining stable electrical performance. Designed for modern lead-free soldering processes, it ensures consistent and reliable results across various applications. The flux is halogen-free, RoHS compliant, and compatible with spray, dip, and foam fluxing methods.

Technical Specifications

• Flux Classification: REL0
• Solid Content (wt%): 2.8 ± 0.8
• Halogen Content: Halogen-free
• Appearance: Pale yellow transparent liquid
• Specific Gravity (g/cm³ @ 20°C): 0.807 ± 0.010
• Acid Value (mg KOH/g): 22.00 ± 5.00
• Expansion Rate (SnPb): ≥ 75%
• Chromate Paper Test: Pass
• Copper Mirror Corrosion: Pass
• Corrosion Test: Pass
• Surface Insulation Resistance (SIR): ≥ 1.0 × 10⁸ Ω
• ECM: Pass
• RoHS Compliance: Pass

Applications

• Lead-free soldering processes using spray, dip, and foam fluxing methods
• PCB assembly for computer motherboards, graphics cards, and video cards
• Communication equipment manufacturing
• Audio device production
• Cooling system electronics
• Medical electronic equipment requiring high reliability
• Applications requiring minimal residue and strong performance in ICT (In-Circuit Test) environments