Rosin-Based Lead-Free Solder Paste 230

DSP 230 is a lead-free solder paste developed with a unique R.M.A. flux system, suitable for both leaded and high-temperature lead-free alloys. It provides strong fluxing activity to ensure thermal stability and prevent degradation during reflow under air atmosphere, eliminating the need for nitrogen and helping reduce production costs. The paste delivers superior joint strength, excellent wettability (especially with SAC alloys), stable print definition, and long tack life. Post-soldering residues are hard, non-conductive, non-corrosive, and highly insulated. It is classified as ROL0 under J-STD-004.

Applications

• SMT stencil printing and reflow soldering using Sn/Ag/Cu (SAC) lead-free alloys
• Lead-free SMT assembly under air reflow (no nitrogen required)
• High-speed SMT production lines requiring stable print definition and long stencil life
• SMT processes requiring excellent wettability and low tombstoning performance
• Electronics manufacturing, SMT & PCBA, and PCB assembly production
• Applications requiring strong solder joints, reliable thermal performance, and post-reflow cleaning of R.M.A. flux residues