Description
RMA 200 (Rosin Mildly Activated) is a rosin-based flux system designed for high-reliability electronic assembly where pure rosin does not provide sufficient wetting and spreading performance. It offers a balanced level of activation to improve solderability while maintaining good electrical reliability of residues. The formulation complies with IPC-J-STD-004B standards. Integrated into flux-cored solder wire, it ensures consistent flux distribution and stable performance, with typical flux content ranging from 1.1% to 3.3% for high-temperature lead-free SAC alloys.
Applications
- Hand soldering and general electronic assembly using rosin-based flux-cored solder wire (e.g., SAC alloys)
- Applications requiring improved wetting and solder spread compared to pure rosin core
- Soldering of oxidized or difficult-to-solder metals requiring higher flux activity
- Electronics manufacturing, SMT & PCBA assembly, and rework processes
- Applications requiring compliance with IPC-J-STD-004B flux classifications (ROL0 / ROM1 / ROH1)
- Assembly and rework processes where residue removal is optional depending on flux activity
- High-reliability electronic applications requiring balanced solderability and electrical performance


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