No-clean water-based flux 355-35

Description

Qualitek® 355-35 is a no-clean, water-based, halide-free flux designed for wave soldering, surface mount, and through-hole assembly applications. It is formulated to remain active after the chip wave, effectively preventing solder ball formation while ensuring strong soldering performance. The flux provides high activity with excellent through-hole fill, making it suitable for lead-free soldering systems. It is VOC-free, environmentally friendly, and supports reliable, high-quality solder joints without the need for post-solder cleaning.

Applications

• Wave soldering using lead-free alloys (SnAgCu, SnAg, SnCu, SnSb)
• SMT, through-hole, and mixed-technology PCB assemblies
• Electronics manufacturing, SMT & PCBA, and high-reliability assembly
• High-volume production lines requiring no-clean processes
• Applications requiring excellent through-hole fill performance
• Processes requiring halide-free and VOC-free flux for environmental compliance
• Soldering processes where flux remains active after chip wave to prevent solder balling
• Manufacturing environments aiming to reduce cleaning cost, process steps, and water usage