Lead-Free Solder Bar Sn99.0Ag0.3Cu0.7

Description

This is a lead-free solder bar manufactured from high-purity tin with Sn99.0Ag0.3Cu0.7 alloy, produced using advanced lead-free soldering equipment and specialized processing technology. The addition of micro-elements helps suppress micro-crack propagation at brittle interfaces, improving joint creep-fatigue life and long-term reliability. The solder bar offers low impurity and oxide content, excellent oxidation resistance, good fluidity, and strong wetting performance, delivering bright and well-formed solder joints under lead-free process control.

Additional information

• Alloy content: Sn99.0Ag0.3Cu0.7
• Melting point: 227 °C
• Density: 7.31 g/cm³
• RoHS: Pass
• Shelf life: 24 months
• Packing: 1 kg/roll, 20 kg/box