High-Solid No-Clean Lead-Free Soldering Flux WTO-718HF

Description

WTO-718HF is a high-solid, no-clean, lead-free soldering flux formulated with premium modified rosin resin, organic activators, specialized additives, and carefully selected solvents. It delivers outstanding soldering performance with excellent wettability, strong tin permeability, and smooth solder flow, resulting in bright, well-filled solder joints. The high solid content enhances coating uniformity and compensates for the lower wettability of lead-free solders. Its no-clean formulation minimizes post-soldering residues while maintaining high electrical reliability. WTO-718HF is halogen-free, RoHS compliant, and compatible with multiple fluxing methods including spray, dip, and foam.

Technical Specifications

• Flux Classification: REL1
• Nonvolatile Content (wt%): 10.80 ± 0.80
• Halogen Content: Halogen-free
• Specific Gravity (g/cm³ @ 20°C): 0.818 ± 0.010
• Acid Value (mg KOH/g): 34.50 ± 5.00
• Expansion Rate (SnPb): ≥ 80%
• Copper Mirror Corrosion: Pass
• Corrosion Test: Pass
• Surface Insulation Resistance (SIR): ≥ 1.0 × 10⁸ Ω
• ECM: Pass
• RoHS Compliance: Pass

Applications

• Lead-free soldering processes using spray, dip, and foam fluxing methods
• Electronics manufacturing for power supply units
• PCB assembly for computer motherboards and graphics cards
• Communication equipment assembly
• Audio and video device manufacturing
• Cooling system electronics
• Medical electronic equipment requiring high reliability