Water-soluble Solder Paste 788
Delta® Solder Paste 788 is a halide-free, water-soluble solder paste for Sn/Pb assemblies, offering high slump resistance, strong tack, and over 8 hours of working time. Residues are easily cleaned with warm deionized water, making it ideal for SMT and PCBA processes requiring post-reflow cleaning.
Description
Delta® Solder Paste 788 is a halide-free, water-soluble solder paste designed for Sn/Pb surface mount and electronic assembly applications. It features excellent slump resistance and uses a low-volatility solvent system, providing a long tack time of over 8 hours. The paste offers high tack force, is non-hygroscopic, and ensures stable printing performance with extended stencil life. After soldering, flux residues can be easily removed using warm deionized (DI) water cleaning systems.
Applications
- SMT stencil printing using Sn63/Pb37 solder paste
- Surface mount soldering with eutectic Sn/Pb alloys
- PCB assembly processes requiring high slump resistance and long tack time
- SMT production lines using water-soluble flux with post-reflow cleaning
- Electronic assemblies where flux residues must be easily removed with DI water
- General electronics manufacturing, SMT & PCBA assembly, and Sn/Pb assembly processes requiring cleaning after reflow
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