Water-soluble Solder Paste 787LV

Description

Delta® Solder Paste 787LV is a water-soluble, low-voiding solder paste specifically developed for high-temperature lead-free alloys. Its advanced flux system provides strong thermal stability, preventing degradation during reflow in air (standard atmosphere). The paste delivers excellent wettability, superior joint strength, low foaming, and extended stencil life, along with a long tack time. It is especially optimized to achieve very low voiding performance in demanding applications such as BGA assembly.

Applications

• Lead-free SMT stencil printing applications
• Reflow soldering with high-temperature Sn/Ag/Cu (SAC) lead-free alloys
• SMT processes requiring very low voiding performance
• BGA assembly requiring low voids and high joint reliability
• Electronics manufacturing processes using water-soluble flux with post-reflow cleaning
• High-reliability SMT & PCBA assembly in lead-free electronics