Underfill adhesive IB-3800 series
Underfill Glue is a specialized adhesive used in electronic assembly to enhance the mechanical strength and reliability of soldered connections. It fills the gap between a microchip and its substrate, providing critical support and protection against thermal cycling, mechanical stress, and environmental factors. Underfill glue ensures improved performance and longevity of electronic components, making it essential for high-reliability applications in industries such as consumer electronics, telecommunications, and automotive.
Features:
– Effectively reduce the impact caused by the mismatch of the overall temperature expansion characteristics between the silicon chip and the substrate or external forces
– Cure quickly when heated, and its lower viscosity allows for better bottom filling, and its higher fluidity enhances its operability for rework
Applications:
– One-component epoxy sealants for CSP or BGA bottom fill processes
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