IBM-ER3042 Two-Component Epoxy

Key Features and Technologies

Item Description
Chemical Type Modified epoxy resin
Appearance (A/B) Transparent liquid
Component Type Two-component
Mixing Ratio 2:1
Curing Condition Room temperature or heating
Curing Method Room temperature curing
Application Electronic components sealing and bonding
Storage Stability 5–35 °C, 12 months

Product overview IBM-ER3042 Two-Component Epoxy

IBM-ER3042 is a two-component epoxy adhesive designed for bonding and sealing electronic components. It provides excellent electrical insulation, heat resistance, moisture resistance, and chemical resistance. The cured product exhibits outstanding mechanical properties and strong adhesion to various substrates, while being environmentally friendly and pollution-free.

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Important Notes

  • Specifications may change without prior notice.
  • Please contact us for consultation before ordering.
  • Product images are for illustration purposes.