Thermal-a-gap Pad 30
In today’s fast-paced electronics industry, efficient thermal management plays a vital role in maintaining system performance and ensuring long-term reliability. At SMT Chemical Solutions, we provide the high-performance THERM-A-GAP PAD 30 Thermally Conductive Gap Filler Pads, specially developed to fill air gaps between heat sinks and electronic components while delivering excellent thermal conductivity and heat transfer efficiency.
Whether you are improving the cooling performance of telecommunications systems, automotive electronics, industrial control modules, or desktop computers, SMT Chemical Solutions’ THERM-A-GAP PAD 30 is engineered to deliver dependable thermal interface performance across a wide range of applications. Let’s take a closer look at its main features, advantages, and technical specifications.
Product Overview
THERM-A-GAP PAD 30 is a thermally conductive gap filler pad developed for efficient thermal management in electronic systems. It is designed to fill air gaps between heat-generating components and heat sinks, ensuring effective heat transfer while maintaining electrical insulation and mechanical compliance.
With a thermal conductivity of 3.2 W/m-K, the material helps reduce thermal resistance and supports stable device operation across a wide range of applications. Its soft and conformable structure allows it to adapt to uneven surfaces, improving interface contact and overall thermal performance.
Key Features
High Thermal Conductivity
Thermal conductivity of 3.2 W/m-K enables efficient heat dissipation from components to cooling structures.
Soft and Conformable Material
30 Shore 00 hardness allows the pad to conform easily to surface irregularities, minimizing air gaps.
Low Outgassing
Reduces the risk of contamination in sensitive electronic assemblies and enclosed environments.
UL 94 V-0 Flammability Rating
Meets stringent fire safety requirements for electronic materials.
Flexible Thickness & Size Options
Available in standard sheet sizes (9″ × 9″, 18″ × 18″) with customizable configurations.
Technical Specifications
| Parameter | Specification |
|---|---|
| Thermal Conductivity | 3.2 W/m-K |
| Thermal Impedance | 0.6 °C·cm²/W |
| Durometer Hardness | 30 Shore 00 |
| Operating Temperature Range | -55 to 200°C (-67 to 392°F) |
| Heat Capacity | 1 J/g-K |
| Volume Resistivity | 10¹³ ohm-cm |
| Dielectric Strength | 150 VAC/mil (5.9 kVAC/mm) |
| Coefficient of Thermal Expansion | 150 ppm/K |
| Flammability Rating | UL 94 V-0 |
| Compliance | RoHS Compliant |
| Shelf Life | 18 months (“A” carrier) / up to 36 months (other carriers) |
Carrier Options
| Carrier Type | Description |
|---|---|
| G – Woven Glass (No PSA) | Reinforced structure, repositionable, no adhesive |
| A – Aluminum Foil (with PSA) | Pressure-sensitive adhesive for firm attachment |
| PN – Polyethylene Naphthalate (PEN) Film | Provides dielectric insulation with balanced performance |
| KT – Thermally Enhanced Polyimide | Improved dielectric strength and shear performance |
Benefits
- Efficient heat dissipation and reduced thermal resistance
- Improved energy efficiency and device stability
- Electrical insulation for circuit protection
- Adaptability to various mechanical designs and tolerances
- Long shelf life depending on carrier type
- Suitable for high-temperature and high-power environments
Typical Applications
- Telecommunications equipment and infrastructure systems
- Consumer electronics (servers, laptops, portable devices)
- Automotive electronics and ECU modules
- Power conversion systems (power supplies, converters)
- LED lighting systems and high-power LED modules
- Medical devices and diagnostic equipment
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