Therm-a-gap gel 75 Thermally Conductive Gel
Thermal-a-gap gel 75 from SMT Chemical Solutions is a high-performance thermally conductive gap filler gel designed to efficiently transfer heat between electronic components and heat sinks. With a thermal conductivity of 7.5 W/m-K, this advanced thermal interface material provides excellent heat dissipation while maintaining strong electrical insulation and long-term reliability.
Description
Therm-a-gap gel 75 from SMT Chemical Solutions is a high-performance thermally conductive gap filler gel designed to enhance heat transfer between electronic components and heat sinks. With a thermal conductivity of 7.5 W/m-K, it provides efficient cooling for high-power and high-density electronic applications.
The dispensable gel formulation allows it to conform easily to uneven surfaces, ensuring optimal thermal contact without the need for curing. It is suitable for both manual and automated dispensing processes, making it ideal for modern manufacturing environments requiring precision and scalability.
Key Features
- High thermal conductivity (7.5 W/m-K) for efficient heat dissipation
- Ready-to-use, no secondary curing required
- Easily dispensable for manual and automated systems
- Low thermal impedance for improved heat transfer
- Low compression force to reduce stress on components
- Reworkable for maintenance and repair processes
- Conforms well to uneven surfaces for optimal contact
Technical Specifications
| Property | Value |
|---|---|
| Thermal Conductivity | 7.5 W/m-K |
| Operating Temperature | -55 to 200°C (-67 to 392°F) |
| Flow Rate | 30 g/min |
| Specific Gravity | 3.4 |
| Heat Capacity | 1 J/g-K |
| Coefficient of Thermal Expansion | 150 ppm/K |
| Dielectric Strength | 220 VAC/mil |
| Volume Resistivity | 10¹⁴ ohm-cm |
| Dielectric Constant | 7.4 @ 1 MHz |
| Dissipation Factor | 0.003 @ 1 MHz |
| Flammability Rating | UL 94 V-0 |
| Outgassing (TML) | 0.18% |
| Outgassing (CVCM) | 0.05% |
| Minimum Bondline Thickness | 0.20 mm (0.008 inch) |
| Shelf Life | 18 months |
| Material Type | Silicone Rubber (VMQ, PVMQ) |
Typical Applications
- Telecommunications equipment (base stations, communication systems)
- Power electronics (power supplies, converters, semiconductor devices)
- Computing systems (CPUs, memory modules)
- High-performance electronics requiring efficient thermal management
- Automated production lines with dispensing systems
Application Process
- Clean the surface to remove contaminants
- Dispense the gel using manual or automated equipment
- Ensure even distribution across the interface
- Assemble components with appropriate pressure
THERM-A-Therm-a-gap gel 75 is designed for applications requiring high thermal conductivity, easy processing, and reliable long-term performance in advanced electronic systems.
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