SN63PB37 Rosin Core Solder Wire – Leaded
Key Features and Technologies
- Fast wetting and strong soldering performance
- Less rosin spattering during soldering
- Uniform flux distribution and good continuity within the wire
- Odorless, low smoke, and free of volatile toxic gases
- Neat winding, attractive appearance, and bright surface finish
Product overview SN63PB37 Rosin Core Solder Wire – Leaded
The Sn63Pb37 leaded solder wire is made from high-purity natural tin materials, containing up to 99.99% pure tin ingot, environmentally friendly and of high quality. It is equipped with a high-tech composite flux core, featuring a unique rosin formulation that provides rapid wetting, low residue, and excellent transparency. The entire production process is carefully controlled – from the selection of premium raw materials to strict process supervision and final inspection – ensuring superior solderability and high-quality solder joints.
Technical specifications
Product Specifications
| Item | Specification |
| Composition | Sn63 Pb37 |
| Packaging | 50g / 100g / 150g / 200g / 250g / 300g / 400g / 500g / 600g / 700g / 750g / 800g / 850g / 900g / 1000g |
| Melting Point | 183 °C |
| Flux Content | 1.8% / 2.0% / 2.2% / 2.4% / 2.6% / 3.0% |
| Wire Diameter | 0.5 mm / 0.6 mm / 0.8 mm / 1.0 mm / 1.2 mm / 1.5 mm / 2.0 mm |
Technical Characteristics
| Type of Solder Wire | Composition (WT%) | Melting Point (°C) | Application |
| Sn63Pb37 | 63%Sn–37%Pb | 183 °C | Suitable for circuit boards requiring high precision, such as instruments, electronic industry, communication, microelectronics, aerospace, and other fine soldering applications. |
| Sn60Pb40 | 60%Sn–40%Pb | 191 °C | For general soldering applications such as household appliances, electrical equipment, automotive electronics, and other general soldering work. |
| Sn55Pb45 | 55%Sn–45%Pb | 200 °C | Suitable for standard PCB soldering and general-purpose use. |
| Sn50Pb50 | 50%Sn–50%Pb | 212 °C | For products that require moderate soldering temperature and bonding strength. |
| Sn45Pb55 | 45%Sn–55%Pb | 227 °C | For higher melting point requirements. |
| Sn40Pb60 | 40%Sn–60%Pb | 247 °C | For special applications requiring stronger solder joints. |
| Sn35Pb65 | 35%Sn–65%Pb | 247 °C | Same as above; higher lead content for specific uses. |
| Sn30Pb70 | 30%Sn–70%Pb | 257 °C | Suitable for applications requiring stronger adhesion. |
| Sn25Pb75 | 25%Sn–75%Pb | 268 °C | Used in automotive and lighting industries. |
| Sn20Pb80 | 20%Sn–80%Pb | 280 °C | Used for high-temperature soldering requirements. |
Applications
Suitable for use in electronic devices, printed circuit boards (PCB), household appliances, industrial electrical equipment, fuses, lighting products, and hardware components..
