Rosin-Based Lead-Free Solder Paste DSP 350

Description

DSP 350 is a lead-free solder paste developed with a unique rosin activated (R.A.) flux system, suitable for both leaded and high-temperature lead-free alloys. It delivers superior joint strength, excellent wettability, and strong print definition, along with a stable and extended tack life. The post-soldering residues are hard, non-conductive, non-corrosive, and highly insulated, ensuring reliability in electronic assemblies.

Applications

• SMT stencil printing using lead-free Sn/Ag/Cu (SAC) solder paste
• Surface mount assembly requiring excellent print definition and long tack life
• High-temperature reflow soldering under air atmosphere
• Electronics manufacturing, SMT & PCBA, and lead-free assembly processes
• Applications requiring strong solder joints and excellent wettability
• Processes using R.A. flux systems with post-reflow cleaning