Rosin-based lead-free solder paste 215D
DSP 215D is a lead-free solder paste with an R.M.A. flux system, designed for syringe dispensing in assembly and rework applications. It offers excellent wettability, strong joint reliability, and non-conductive, non-corrosive residues after soldering.
Description
DSP 215D is a lead-free solder paste formulated with a unique R.M.A. dispensing flux system, suitable for both leaded and lead-free alloys such as SAC and Sn/Ag. Designed specifically for dispensing applications, it is available in 10cc and 30cc syringes for easy use in rework and precision assembly processes. The paste provides superior joint strength and excellent wettability, ensuring reliable soldering performance. Post-soldering residues are hard, non-conductive, non-corrosive, and highly insulated.
Applications
- Surface mount soldering using syringe dispensing method
- SMT assembly requiring dispensing solder paste for lead-free SAC alloys
- Electronic rework and repair applications
- Precision dot dispensing processes requiring strong joint strength and excellent wettability
- Electronics manufacturing, SMT & PCBA assembly, and rework processes
- Lead-free assembly using R.M.A. flux systems with post-reflow cleaning
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