No-clean solder paste XP692

Description

DSP XP692 is a next-generation no-clean solder paste designed for conventional Sn/Pb surface mount and electronic assembly applications. It supports fine-pitch printing (<16 mil) and high-speed production, delivering excellent wettability, sharp print definition, and long tack life. The formulation ensures low residue after reflow, with soft, non-tacky, non-conductive, and non-corrosive residues, making it suitable for reliable and clean assembly processes. It is compatible with various stencil types and optimized for forced-air convection reflow ovens.

Applications

• SMT reflow soldering for Sn/Pb (leaded) processes
• Stencil printing for PCB assembly
• High-speed automated SMT production lines
• Electronics manufacturing, SMT & PCBA assembly, and rework processes
• Leaded soldering applications requiring no-clean, low-residue performance
• Processes using Type 3 and Type 4 solder powder and various stencil types (chemical-etched, electroformed, laser-cut)