No-clean solder paste 670I

Description

Delta® Solder Paste 670I is a halide-free, no-clean solder paste designed for Sn/Pb surface mount and electronic assembly applications. As a drop-in ready solution, it is optimized for high-speed production with a high tack formula suitable for fast component placement systems. The paste delivers excellent wettability and print definition, along with low residue after reflow. Post-soldering residues are non-conductive, non-corrosive, and highly insulated, ensuring reliable and clean assembly performance. It is compatible with various stencil types and designed for use in forced-air convection reflow ovens.

Applications

• SMT reflow soldering for Sn/Pb (leaded) processes
• Stencil printing for PCB assembly
• High-speed automated SMT production lines
• Electronics manufacturing, SMT & PCBA assembly, and rework processes
• Leaded soldering applications requiring no-clean, low-residue performance
• Processes using Type 3 and Type 4 solder powder and various stencil types (chemical-etched, electroformed, laser-cut)