N350 Ti-Alloy Dual Wave Soldering Machine
Currency:
Reference price converted from USD.
Product Description
The JAGUAR N350 is a high-capacity, lead-free dual wave soldering machine engineered for demanding DIP (Through-Hole) PCB assembly lines. Featuring a titanium-alloy solder pot and a robust 3-stage hot air preheating system, the N350 delivers consistent, high-quality solder joints across a wide range of PCB formats — from consumer electronics to automotive and industrial applications.
Designed for efficiency, energy savings, and environmental compliance, the N350 combines PLC-based automation with a user-friendly touchscreen interface, making it simple to operate while maintaining strict process control. Its continuous inline conveyor design ensures seamless integration into any SMT/DIP production line, supporting both lead-free and Sn-Pb soldering processes.
Key Features
| Key Features | |
| Ti-Alloy Solder Pot: | Titanium alloy construction eliminates tin adhesion and corrosion, dramatically extending pot lifespan compared to standard cast iron or SS pots. |
| Dual Wave Soldering: | Chip wave (turbulent) + smooth wave configuration ensures complete solder penetration on complex through-hole and mixed-technology boards. |
| 3-Stage Hot Air Preheat: | Independent 3-zone preheating with total length of 1,600 mm; temperature uniformity within ±2°C for reliable flux activation and thermal stress reduction. |
| Stepper Motor Flux Spray: | Japanese scanning spray nozzle with rodless pneumatic cylinder and PLC control ensures even, precise flux application — reliable and consistent every cycle. |
| Ti-Alloy Conveyor Fingers: | Titanium alloy transport chain fingers with double V-groove, non-stick tin design; reinforced for long-term durability and clean solder quality. |
| PC + PLC Control System: | Dual control architecture (PC + PLC or Touchscreen + PLC options) with Win7 OS, bilingual Chinese/English interface, and black-box SPC data logging. |
| Lead-Free & Pb Solder Ready: | Supports both lead-free (SAC alloys) and traditional Sn-Pb soldering processes; independent furnace design for easy cleaning and process changeover. |
| Nitrogen Option Available: | Optional nitrogen atmosphere module with high-accuracy oxygen analyzer; nitrogen consumption ~16 m³/hr at 1,000 ppm for oxide-free, high-quality joints. |
| Auto Claw Cleaning: | Automatic conveyor claw washing system maintains claw cleanliness to prevent solder bridging and contamination defects. |
| Energy-Efficient Design: | Running power as low as 7 kW during production; frequency converter drive and intelligent board detection minimize power consumption and flux waste. |
Technical Specifications
| Specification | Details |
| Model | JAGUAR N350 |
| Machine Type | Dual Wave Soldering Machine (Chip Wave + Smooth Wave) |
| Input Voltage | 380V AC / 50~60Hz (3-phase) |
| Total Power | ≤ 20 kW |
| Running Power | ~7 kW (during production) |
| Solder Power | 380V / 12 kW |
| Preheat Power | 220V / 8 kW |
| Preheat Zones | 3 independent zones (hot air) |
| Preheat Length | 1,600 mm total |
| Preheat Temp. Uniformity | ±2°C |
| PCB Board Width | 50 ~ 350 mm (adjustable) |
| Conveyor Speed | 300 ~ 2,000 mm/min (adjustable) |
| Conveyor Direction | Left to Right (Right to Left optional) |
| Conveyor Angle | Adjustable (contact factory for range) |
| Solder Pot Material | Titanium Alloy |
| Solder Pot Capacity | ~280 kg (330 kg variant available) |
| Solder Pot Temperature | Up to 400°C |
| Solder Type | Lead-Free (SAC) / Sn-Pb |
| Solder Temp. Control | PID + SSR dual independent outer-heating |
| Wave Crest Drive | 220V / 1 kW imported high-frequency inverter motor |
| Flux System | Stepper motor scanning spray; Japanese nozzles + rodless pneumatic cylinder |
| Air Supply | 0.5 MPa |
| Machine Dimensions (Body) | 3,300 (L) × 1,420 (W) × 1,750 (H) mm |
| Machine Dimensions (Overall) | ~4,100 (L) × 1,420 (W) × 1,750 (H) mm |
| Machine Weight | ~1,300 kg |
| Control System | PC + PLC / Touchscreen + PLC (options available) |
| OS / Interface | Windows 7; Chinese & English bilingual |
| Solder Warm-up Time | ~120 min to reach 250°C |
| Preheat Warm-up Time | ~10–15 min to reach 150°C |
| Nitrogen Option | Available (O₂ analyzer; ~16 m³/hr at 1,000 ppm) |
| Certification | CE, ISO 9000, RoHS, CCC |
| Warranty | 1 Year |
| Place of Origin | Shenzhen, Guangdong, China |
| * Specifications may vary. Please contact Jaguar or your authorized distributor for the latest confirmed datasheet. | |
Applications
The JAGUAR N350 is suited for high-volume, high-reliability through-hole and mixed-technology soldering processes including:
- Through-hole component soldering in high-volume DIP assembly lines
- Mixed-technology PCB assembly (SMT + DIP) production
- Automotive ECU, power module, and sensor PCB soldering
- Industrial control boards, relay modules, and connector-heavy assemblies
- LED driver boards and power supply PCB production
- Telecommunications and networking equipment PCB manufacturing
- Medical device PCB assemblies requiring precise temperature control
- Aerospace and defense high-reliability through-hole soldering
Industries Served
- Consumer electronics and smart device manufacturing
- Automotive electronics (ECUs, ADAS modules, LED lighting, EV battery systems)
- Aerospace & defense high-reliability PCB assemblies
- Medical devices and life sciences electronics
- Industrial automation, power electronics, and control systems
- Telecommunications, networking, and 5G infrastructure
- LED lighting and display panel production
Why Choose the N350?
| vs. N300 / N250 (Smaller Models) | vs. Standard Cast Iron / SS Solder Pot |
| Larger PCB width capacity (350 mm), longer preheat zone (1,600 mm), higher solder pot volume — ideal for bigger boards and higher throughput. | Titanium alloy pot resists tin corrosion and adhesion — significantly longer pot lifespan, lower maintenance cost, and cleaner solder joints. |
| vs. Single Wave Machines | vs. Selective Soldering |
| Dual wave (chip + smooth) ensures full solder coverage on complex through-hole boards including connectors and mixed-tech assemblies. | Full-board wave soldering is dramatically faster for high-volume DIP production; selective soldering suits low-volume mixed-technology boards. |
