Low temperature epoxy adhesive
Low Temperature Epoxy Adhesive is specially formulated to cure effectively at lower temperatures, making it ideal for applications where heat-sensitive materials are involved. This adhesive provides strong, durable bonds and is suitable for a variety of substrates, including metals, plastics, and composites. Its low-temperature curing capability ensures minimal thermal stress, preserving the integrity of the materials being bonded.
Features
– Single-component modified epoxy resin adhesive
– Used for low temperature thermal curing and can form the best bonding force between various materials
Applications
– Mainly used in: memory cards, CCD/CMOS, LED backlight lens bonding and other devices, especially suitable for the assembly and bonding of heat-sensitive components that require low temperature curing.
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