Low-solid No-Clean Lead-Free Soldering Flux WTO-810

Description

WTO-810 is a low-solid, no-clean, lead-free soldering flux formulated with enhanced rosin and resin systems, organic activators, specialized additives, and selected solvents. It delivers excellent solderability with strong wettability, smooth solder flow, and reliable tin penetration, resulting in bright and well-formed solder joints. Designed for modern lead-free processes, it withstands high soldering temperatures while maintaining stable performance. The formulation leaves minimal, evenly distributed residues, ensuring high electrical reliability without the need for cleaning. It is halogen-free and compliant with RoHS standards, and suitable for multiple fluxing methods including spray, dip, and foam.

Technical Specifications

• Flux Classification: REL0
• Solid Content (wt%): 4.0 ± 0.8
• Halogen Content: Halogen-free
• Appearance: Pale yellow liquid
• Specific Gravity (g/cm³ @ 20°C): 0.800 ± 0.005
• Acid Value (mg KOH/g): 26.50 ± 5.00
• Chromate Paper Test: Pass
• RoHS Compliance: Pass

Applications 

• Lead-free soldering processes using spray, dip, and foam fluxing methods
• Electronics manufacturing for power supplies and power electronic products
• PCB assembly for computer motherboards and graphics cards
• Communication equipment assembly
• Audio device manufacturing
• Cooling system electronics
• Medical electronic equipment requiring high reliability and clean no-clean performance