Leaded LED solder paste Sn63Pb37

Description

This is a leaded solder paste designed for stable printing and reliable reflow soldering in electronic assembly. Based on the Sn63Pb37 alloy, it provides consistent wettability, good print definition, and strong process stability, making it suitable for high-volume production. With a melting point of 183 °C and a no-clean reflow process, it ensures efficient assembly and clean solder joints for precision applications.

Applications

• Military electronics
• Aerospace components
• Instrumentation (water meters, electricity meters, gas meters)
• LED assembly and soldering