Lead-Free SMT Solder Paste SAC105-4A
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Description
SAC105-4A is a universal lead-free SMT solder paste designed for stable and efficient soldering in consumer electronics manufacturing. Based on SAC105 alloy, it produces bright solder joints with colorless, transparent residues and ensures a high first-pass yield in SPI printing. The paste is optimized for conventional OEM production processes, offering excellent compatibility with common PCB finishes such as OSP, ENIG, and HASL. It supports fine-pitch applications down to 0.4 mm and 0201 components without grape ball defects, ensuring reliable and consistent soldering performance.
Applications
- Consumer electronics manufacturing
- Feature phones and portable devices
- White goods and black appliances
- E-cigarettes and small electronic devices
- Small household appliances
- SMT stencil printing and reflow processes for fine-pitch PCB assembly
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