Lead-Free LED Solder Paste Sn64Bi35Ag1
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Description
SL-P-LF2002 is a lead-free solder paste developed for stable and reliable LED assembly. Formulated with Sn64Bi35Ag1 alloy, it offers moderate activity and good fluidity, making it suitable for both stencil printing and dispensing in medium-temperature processes. With a melting range of 151–179 °C and no-clean reflow capability, it supports efficient and consistent production. The solder joint strength is approximately 60% of SAC305, making it suitable for applications where lower mechanical strength is acceptable.
Applications
- LED assembly and soldering
- SMT stencil printing and dispensing processes
- Medium-temperature reflow soldering
- Electronics assembly requiring lead-free, halogen-free, no-clean solder paste
- Applications where reduced thermal stress is needed due to lower melting temperature
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