Key Features and Technologies
| Item | Description |
| Chemical Type | Modified epoxy resin |
| Appearance (A/B) | Transparent liquid |
| Component Type | Two-component |
| Mixing Ratio | 2:1 |
| Curing Condition | Room temperature or heating |
| Curing Method | Room temperature curing |
| Application | Electronic components sealing and bonding |
| Storage Stability | 5–35 °C, 12 months |
Technical specifications
| Property | Unit | Value |
| Density @25 °C | g/cm³ | 1.1 |
| Mixed Viscosity @25 °C | mPa·s | ≤ 3000 |
| Working Time @25 °C | min | ≥ 20 |
| Tack-free Time @25 °C | h | ≤ 4 |
| Full Cure Time @25 °C | h | ≤ 36 |
| Light Transmittance (2 mm thick) | % | ≥ 90 |
| Tensile Strength | MPa | ≥ 50 |
| Shear Strength | MPa | ≥ 50 |
| Hardness (Shore D) | Shore D | 60–70 |
| Elongation | % | 2 |
| Initial Adhesion (SUS) | MPa | ≥ 10 |
| 85 °C / 85 % RH, 168 h | No change | |
| Thermal Shock −20 °C / 100 °C, 100 cycles | No change |
Applications
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Electronics: Bonding and sealing electronic components, potting, insulation, and moisture protection.
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Manufacturing: Fixing metal, plastic, ceramics, glass, composite materials, and structural parts.
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Automotive & Machinery: Repairing cracks, filling gaps, reinforcing parts, and ensuring vibration resistance.
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Household Use: DIY repairs, bonding household items, and general maintenance.
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Handicrafts: Craft bonding, model making, and handmade projects requiring strong adhesion.
See also: CHUERA 969D Soldering Station, SN63PB37 Rosin Core Solder Wire – Leaded , JIT-Asia






