No-clean solder paste 699

Description

DSP 699 is a high-activity, no-clean, halogen-free solder paste designed for a wide range of lead-containing alloys. It delivers extreme fluxing activity with excellent wettability, particularly on copper OSP-coated surfaces. The formulation provides a wide reflow process window and strong thermal stability, resulting in smooth and reliable solder joints. It also offers consistent and repeatable printing performance, extended stencil life, and long tack time, making it suitable for high-speed production and ultra-fine pitch applications. The paste demonstrates excellent resistance to hot slump and supports precise printing on small pad sizes.

Applications

• SMT reflow soldering for leaded alloys (e.g., Sn63/Pb37)
• Stencil printing for PCB assembly, including ultra-fine pitch designs
• High-speed SMT printing and production processes
• Electronics manufacturing, SMT & PCBA assembly
• Applications requiring strong wettability on OSP-coated copper surfaces
• No-clean soldering processes where residue removal is not required