Lead-Free Solder Bar Sn99.3Cu0.7
This is a lead-free solder bar formulated with high-purity tin and premium-grade copper (Sn99.3Cu0.7), manufactured using advanced lead-free soldering equipment and specialized processing technology. It features low metal impurities and reduced oxide content, providing excellent anti-oxidation performance and minimal solder dross generation. With good fluidity, low viscosity, and strong wetting ability, the solder bar delivers stable soldering performance and bright, well-formed solder joints, supporting reliable lead-free process control.
Description
This is a lead-free solder bar formulated with high-purity tin and premium-grade copper (Sn99.3Cu0.7), manufactured using advanced lead-free soldering equipment and specialized processing technology. It features low metal impurities and reduced oxide content, providing excellent anti-oxidation performance and minimal solder dross generation. With good fluidity, low viscosity, and strong wetting ability, the solder bar delivers stable soldering performance and bright, well-formed solder joints, supporting reliable lead-free process control.
Application
This solder bar is designed for the electronic assembly industry and is widely used in communication equipment, instrumentation devices, automotive electronics, audio systems, and household electrical and electronic appliances. It is suitable for both manual and automatic soldering processes.
Additional information
- Alloy content: Sn99.3Cu0.7
- Melting point: 227 °C
- Density: 7.31 g/cm³
- RoHS: Pass
- Shelf life: 24 months
- Packing: 1 kg/roll, 20 kg/box
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